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A System to Package Perspective on Transient Thermal Management of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: There are many applications throughout the military and commercial industries whose thermal profiles are dominated by intermittent and/or periodic pulsed thermal loads. Typical thermal solutions for transient applications ...
Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Researchers have been extensively studying wide-bandgap (WBG) semiconductor materials such as gallium nitride (GaN) with an aim to accomplish an improvement in size, weight, and power of power electronics beyond current ...
Thermal Management and Characterization of High-Power Wide-Bandgap Semiconductor Electronic and Photonic Devices in Automotive Applications
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: GaN-based high-power wide-bandgap semiconductor electronics and photonics have been considered as promising candidates to replace conventional devices for automotive applications due to high energy conversion efficiency, ...
Characterization of the Interdependence Between the Light Output and Self-Heating of Gallium Nitride Light-Emitting Diodes
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: With the advent of gallium nitride (GaN) as an enabling material system for the solid-state lighting industry, high-power and high-brightness light-emitting diodes (LEDs) with wavelengths ranging from near ultraviolet to ...
The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Gallium nitride (GaN) has emerged as one of the most attractive base materials for next-generation high-power and high-frequency electronic devices. Recent efforts have focused on realizing vertical power device structures ...